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Esec 8003
Ref :
2612171-9-W
Condition :
Used
Manufacturer :
Esec
Model :
8003
Year(s) :
-
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Last check :
07 Jul. 2025
Specification:
Diameter of substratum disc (wafer): 25,4 - 152,4 mm (1" – 6")
Thickness of substratum disc (wafer): 0,01–5,0 mm
Minimal width of cut: 250 μm pre Si wafer
Minimal size of the chip: 1x1 mm
Axle X (shift): 240 mm
Axle Y (index): 165 mm
Index of the step: 0,02–100 mm
Axle Z (vertical): 10 mm
Angular displacement: 0,01–165 stupňov
Spindle speed: 15,000–50,000 rpm
Air pressure: 4,4 - 5,8 bar (64-85 psi)
Water pressure: do 5,8 bar (85 psi)
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