EVG 510 Wafer Bonder

EVG 510 Wafer Bonder consisting of:
- Model: 510 Wafer Bonder
- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Windows based control software and operation interface
- Wafer size: up to 6”/150mm capable
- Max Bond Force: 20 kN (this is to be confirmed once the tool arrives at LES)
- Top side heater: 550°C max. in 1°C steps
- Bottom side heater: 550°C max. in 1°C steps
- Temperature uniformity: ± 1,5 %Turbo pump and controller
- Roughing pump
- Load/unload tool
- System computer, monitor, and keyboard
- PDF Operations Manual for EVG 510 Bonder

Condition:
Excellent Condition Guaranteed.
Fully Refurbished to Factory Specifications
6 Month Warranty and Full Specifications Guarantee.
30 Day Right of Return.