EVG 520 Wafer Bonder

• Type: Manual wafer load substrate bonder
• Bonding methods: Fusion compression bonding
• Bonding methods: Thermal compression bonding
• Bonding methods: Anodic bonding
• Application: R&D and pilot production
• Bond chamber: High-vacuum capable
• Bond tool cover: Auto opening
• Control software: Windows-based with operation interface
• Wafer size: Up to 200 mm
• Accessories: Quartz pressure insert
• Accessories: Contact electrode
• Accessories: Graphite electrode
• Accessories: Bond glass
• Power supply: High voltage
• Max bond force: 10 kN
• Top side heater: 550°C max, 1°C steps
• Bottom side heater: 550°C max, 1°C steps
• Chiller: Included
• Temperature uniformity: ±1.5%
• Roughing pump: Included
• Load/unload tool: Included
• System computer: Included
• Monitor: Included
• Keyboard: Included
• Manual: Operations manual included
• Inspection: Available for full inspection and demonstration
• Condition: Excellent
• Refurbishment: Fully refurbished to factory specifications