EVG 620

- Manual Mask Aligner
- Topside Alignment (TSA)
- Manual Alignment
- Up to 6"/150mm Wafer Capable (with proper chuck)
- Objectives (Qty 2)
- Vacuum Chuck: request at time of order
- Maskholder: request at time of order
- Mask Load Frame: request at time of order
- Can be Operated in Proximity, Soft Contact, Hard Contact or Vacuum Contact Exposure Modes
- Tooling Exchanges are Quick, Simple and can be Performed Within Minutes
- Lamphouse: 500W Lamphouse
- Exposure Optics: Type C, 350nm - 450nm, Broadband
- Microsoft Windows based User Interface
- System PC, Keyboard, Cables
- Operations Manual for EVG 620