EVG Smartview Bond Aligner

Wafer Size Range
Minimum 150 mm
Maximum 300 mm
Set Size 300 mm
Other Information
• High resolution alignment stage with DC servomotors in X, Y and Theta
• Alignment accuracy +/- 1 um (one sigma) with 20x objectives
• Top and bottom stage with precision measurement system
• Complete computer control of all mechanical movements in the aligner.
• 17" flat screen for operator interface and alignment functions
• Joystick control of all alignment movements and microscope movement in Z.
• Unique three spindle alignment stage for shift free Z movements
• Remote Diagnostics via modem