F&K Delvotec G5 Wire Bonder

F&K Delvotec G5 - Single
Bond process Control System BPC2000 Option
Deep Access Thin Wire bond head option
Thin Wire Spool Option
BPD Viewer Option

Base System:
Standard bonding area X/Y: 254mm x 152mm (10” x 6” )

Modular machine concept including:
Main components
Extremely rugged machine frame
Minimum dimensions of required floor space 1777 mm x 620 mm x 1273 mm -(height x width x depth)
Working height adjustable from 850mm -1050mm, fulfil SMEMA requirement (940 -965 mm)
Control and power electronics based on industry standards

Pentium®M based cPCI CPU Unix®
-based real time multi
-tasking operating system
high capacity hard disk drive (>60 GB, ruggedised system)
standard network connectivity TCP/IP, SMEMA, SECS/GEM
(SEMI E30), HSMS graphical multi - window user interface
19“ TFT flat screen monitor
Menu controlled teach -in
direct parameter input
pattern recognition display
process status & message display
service interface
linear drive X -Y table with 10“ x 6“ bond area
X = 254 mm (10”); Y = 152 mm (6”); Z = 40 mm
high resolution linear encoders in X and Y
AC servo motor with absolute encoder in Z and P axes
high speed numeric control system
programmable dual source work area lighting
electronic touch down sensor for every bond
individual height sensing per component or bond pad
Microscope:
stereo zoom
adjustable
light intensity
Status Light
easy programmable
Ultrasonic Generator

digital F&K Delvotec ultrasonic system
voltage, current or power controlled
programmable from 30 to 250 kHz operating frequency
up to 40 watts ultrasonic power output
pattern recognition unit PRU

CCD camera with custom optics adapted to product
moving camera in Z axis
programmable focus for each recognition point
Cognex®8000 Pat Max®system
256 greyscale processing
pattern recognition
edge recognition
tilted image option
programmable size search window
640 x 480 Pixel Camera
process adjustment
programme complexity virtually unlimited
up to 150 chips recognition reference images
up to 50.000 wires
no restriction on bond height within work area
programmable force / time ramp
bond parameter settings
offset values per program
standard values per chip
individual settings per bond
loop shape settings
automatic or programmed loop height setting
automatic control of bond height
standard values per program
standard values per chip
individual settings per wire work area lighting
programme controlled type and intensity
direct red LED standard