KLA-Tencor Surfscan 6400

- Bare Wafer Surface Defect Inspection System
- System can handle up to 200mm capable
- Cassette Handling: Single puck handling from single cassette or platform
- Substrate Thickness: Automatic adjustment within 2 mm range
- Material: Any surface that scatters less than 90% of incident light
- Defect Sensitivity:
- Most Surfaces: Better than 0.20 um (depending upon surface quality)
- Polished Silicon: Better than 0.15 um at 95% capture rate
- Repeatability Error: Count repeatability error less than 1.5% at 1 standard deviation (Mean count greater than 500 for 0.364-um diameter latex spheres on bare silicon)
- Count Accuracy: Better than 99% as verified with VLSI Standards
- Relative Standard Spatial Resolution: 50 um spacing, minimum
- Dynamic Range: 0.1 um to 100 um in a single measurement
- Throughput:
- Up to 120 wafers per hour using 150 mm wafers
- Up to 95 wafers per hour using 200 mm wafers
- Contamination: Less than 0.5 particles/cm squared greater than 0.20 um diameter per single pass
- Illumination Source:
- 30 mW Argon-Ion laser
- 488 nm wavelength
- Operations Manual and Documentation
- Power: 208V, 1PH, 17A, 60Hz