Koh Young Aspire 2

3D Solder Paste Inspection System
100% 3D Paste Measurement based on the patented Shadow-Free measurement technology
High Speed 3D Measurement Intelligent user interface and SPC tool for process optimization
Metrology Capability: Volume, Area, Height, Offset, Bridging and Shape Deformity
Types of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset
10% Gage R&R on 01005 deposits
Max. PCB Size: 510 x 510 mm 20.08 x 20.08 inch
Min. PCB Size: 50 x 50 mm 1.97 x 1.97 inch
PCB Thickness: 0.016 ~ 0.20 inch
Machine Weight: 1320 lbs
Manuals Computer, Keyboard and Monitor Very Low Use!
Fully Functional!