MPI LEDA-8F 3G Plus-V 110

MPI LEDA-8F 3G Plus-V 110 3G Wafer Prober.
Plus-V is a wafer prober for testing diced die on stretch frame
(dies on blue tape mounted on a tape ring).
Wafers cut, broken by scribing, laser etc. and then expanded on
stretch frame. May be tested to determine if any secondary operations have
damaged the product. The maximum test area for the system is 6 inches of
active die area or smaller.
Machine Features: 3G Plus-V provides the functions of
die position information saving, auto-probing, testing etc.
It contains these advantages:
* Automatic diced wafer alignment.
* Rapid pre-scan provides fast die position information speeding test
and increasing throughput. Probe station for
testing LED light emitting diodes.
Compact rigid and reliable semiautomatic chip probing system.
PC controller. 5 in. dia. vacuum chuck. Four precision probe manipulators.
StereoZoom microscope.
WEI Industries Co. Ltd model LED-632HC LED tester.
This controller tested for power only, not LED testing. 110V, 50/60 Hz.