AccuSputter AW 4450 Sputter

AW 4450 Sputter
Wafer Size: Small~8 inch
Wafer loading: Manual, with Load Lock
Cathodes: 3xDelta Shape OR 4xCircle Shape
Sputter Methods: RF/DC; Diode/Magnetron
Gas Lines: 1~3 MFCs

Features
Process Proven for III-V substrates
Non-PLC (Smaller footprint / easy maintenance)
20+ years proven sputter technology
New optimum AW-4450 System Control
DC 24V for Motors,Actuator,Relay,Solenoid
Efficient 8″ ,Delta cathodes, 2 to 6″ option
High throughput operation
High Uniformity and Yield
DC, RF Sputter, Pulse DC option
Magnetron and Diode Sputter option
RF Etch and Bias are optional
Ultra Clean vacuum system
Load lock operation
UHV design
Flexible for development or production use
Full range of substrate sizes and shapes
Various pumping and power options
Co-sputtering option