Pesl
Ref :
1806130-9-CP
Condition :
Used
Manufacturer :
Pesl
Model :
-
Short Description :
-
Year(s) :
-
Quantity :
0
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Last check :
18 Apr. 2018
PESL Heated stage flip chip bonder DB5/TC designed for the assembly of all types and sizes of semi-conductor dice . Vertical tool action with CCTV Veertical illumination via split field optics Dual camera system Manual overide facility Heated substrate Electronic positioning via a mouse. 282
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