Pesl
Ref :
1806130-9-CP
Condition :
Used
Manufacturer :
Pesl
Model :
-
Short Description :
-
Year(s) :
-
Quantity :
0
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Last check :
18 Apr. 2018
PESL Heated stage flip chip bonder DB5/TC designed for the assembly of all types and sizes of semi-conductor dice . Vertical tool action with CCTV Veertical illumination via split field optics Dual camera system Manual overide facility Heated substrate Electronic positioning via a mouse. 282
Other machines similar to Pesl
1
Delvotec 4500/Siplace A2 Die Bonder
Location :
AMERICA North (USA-Canada-Mexico)
Year(s) :
2006
1
Westbond 7400A Ultrasonic wire bonder
Location :
AMERICA North (USA-Canada-Mexico)
1
Datacon EVO2200 Die Attach Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2007
1
Esec DB 2007 SSI plus Die Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2006