Royce Autoplacer MP300 for wafers up to 200mm

Royce Instruments MP300 Autoplacer
Maximum 200mm wafer (motorized xy stage has 8x8 travel)
includes 3 die pickup assemblies
All manuals and software included

Specifications:
Electronic wafer map
Up to 16 x 2 inches (50mm) waffle pack or Gel-Paks
Quad needle eject head, up to 3 mm eject height
Die size from approx. 0.76 “ 25.6 mm square
Standard soft surface contact vacuum pick up
Non surface contact mechanized die pick and place system

Microscan DOAL® (Diffuse On-Axis Light) illuminator provides diffuse,
uniform illumination for flat specular surfaces. With the coaxial lighting approach,
specular surfaces perpendicular to the camera appear bright,
while surfaces surfaces which are marked or embossed absorb light and appear dark.
By providing greater uniformity than conventional sources,
DOALs increase machine vision accuracy and repeatability.
Smart Series Technology: Built-in controller with continuous and
high output strobe modes
Provides superior uniformity throughout the illumination envelope
Passively cooled
The ability to process die using either wafer maps or ink dot recognition.
The Die Sort Manager has an extensive library and can accommodate the
latest software formats as well as the many older/legacy wafer map formats.
The quick change flexibility makes it ideal for volumes from a few prototype wafers
to high volume production.
Micron level control of the die ejection enables the handling of die as thin as
50 microns without damage.
Die pick-up and handling include the conventional vacuum pick-up and also a
unique non active surface handling technology which allows the sorting and placement
of fragile die such as GaAs die with air bridges, MEMS, microfluidics, Lab-on-Chip,
biochips, optoelectronics and inkjet heads.
Allows transition from one wafer size to another whether larger or smaller, or to a
completely different format to allow full utilization of downstream equipment and
processes.
This is particularly important when picking die from multi-project wafers,
the so called “Pizza Wafers.”
Customer or device specific parameters are easily stored and maintained to
allow easy recall and implementation of proven programs at a later date to
ensure the reliable and repeatable processing of all die.
The fully automated process will sort and bin entire wafers without
operator input allowing 100% die traceability.
For MEMS type devices where the die surface cannot be touched the MP300 utilizes a
custom gripper which can pick up the die from the sides and whose force is
fully adjustable between 0 to 20 grams.