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STS Multiplex ICP Deep Reactive Ion Si Etcher
Ref :
2805122-9-W
Condition :
Used
Manufacturer :
STS
Model :
Multiplex ICP Deep Reactive Ion Si Etcher
Year(s) :
1997
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
STS Deep Reactive Ion Si Etcher (Bosch Process)
Vintage 1997
200mm
The STS Multiplex DRIE uses the Bosch process for
etching silicon deep and anisotropic. In addition to
the platen RF power supply for RIE the system also
has an ICP RF source for independently controlling
the plasma density from the DC Bias.
The system uses a water cooled electrode and He
backside flow to keep the sample cool. This system
is designed to etch a 200 mm wafer.
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