Suss SB8e Substrate Bonder

SUSS SB8e SUBSTRATE BONDER consisting of:
- Model: SB8e
- Manual Wafer Load Wafer Bonder
- Tooling: one Top SiC chuck, one Bottom SiC chuck, one Fixture, all sized
for 6"/150mm wafers
- Piston Force: 20kN Max.
- Vacuum down to 5x10e-5 mbar.
- Overpressure control with 3 bar max
- Pos/neg 2000V/15ma power supplies
- Bonding in controlled environment
- Flexible process control using a Windows operating environment
with data recording and analysis
- Bond Types capable: Anodic, Silicon Fusion, Adhesive,
Thermal Compression, Glass Fritt
- Temperature Control to 500 degrees C
- Top and Bottom Heaters
- Vacuum Pump
- Turbo Pump
- Operating Manual
- CE Marked