Technics

Technics RIE 800 Etcher & Stripper (Technics RIE 800 Etcher )

*Utilizes various components working in a specific sequence to etch a thin film from a substrate or work piece
*Reactive Ion Etching (RIE) combine plasma and ion beam removal of the surface of a substrate
*The etching gas (as in plasma etch) enters the reaction chamber and is ionized by the application of an electric field, such as RF
*Individual gas molecules are accelerated to the substrate surface. These charged particles remove the top layer of material by the combined efforts of mechanical and chemical reactions
*The high precision 800 SERIES MICRO RIE system provides small and large wafer development capability comparable to high capacity systems
*Additionally, the 800 SERIES MICRO RIE is ideal for analysis of IC and hybrid circuit devices.