Tepla 600-AL

– Used for photoresist stripping and surface cleaning, as well as etching silicon and its compounds
– Chamber Size: 245mm diameter, 380mm depth
– Chamber Material: ceramic
– ENI RF Generator: 0-600 Watt, 13.56 MHz
– Semi-Automatic RF Plasma System
– Can process up to 200mm wafers
– Gases: 4 channels controlled by 4 MFCs
– Leybold D65B Vacuum Pump
– Dimensions: 740mm x 624mm x 701mm + connections
– Electrical: 230V, 50/60Hz, 15A, 2kW