Westbond 4KE Semiautomatic convertible wire bonder

The West Bond 4KE is a semi-automatic wire bonder known for
its 3-way convertible design, allowing it to be used for wedge,
ball, or ribbon bonding. It features a gantry design with a motorized Z (vertical)
and Y (forward/backward) axis for programmed wire loops,
and a manually controlled X (side-to-side) axis.
This system is ideal for high-power and high-frequency applications
requiring precise, repeatable bond shapes and is popular in
the microwave, semiconductor, and hybrid product industries.

Key Features and Capabilities
3-Way Convertible Design:
Quickly switch between wedge, ball, and ribbon bonding by exchanging the
bond head, clamp assembly, and software mode.
Motorized Z and Y Axes:
Microprocessor-controlled motors drive the Z and Y axes for
precise, programmed control over the wire loop height and shape,
maintaining consistency for multiple bonds.
Manual X Axis:
A unique West•Bond micromanipulator allows for manual,
precise positioning of the target location.
Gantry Design:
The entire mechanism is positioned above the workplane, allowing
for unlimited part size and shape accommodation for both small
and large components.
Dual Force Mechanism:
Provides two pre-set force values, allowing for either a high or low force
to be programmed for any bond.
Radiant Tool Heat:
The bond tool is heated with a panel-mounted radiant heater controlled
by a constant current.
Integrated Vision System:
A high-resolution camera with a crosshair generator provides an
accurate view of the bonding area, allowing for precise target acquisition
on an external monitor.
ESD Protection:
The system includes conductive and dissipative features to
protect against electrostatic discharge.

Applications
High-Frequency and High-Power Devices:
Excellent for applications where identical bond and loop shapes are critical, such
as in microwave, semiconductor, and hybrid products.
Large Substrates:
The gantry design and throat-less chassis provide unlimited access
to remote bonding targets on large packages and modules.

Bond Force: 10 – 150 grams;
Au / Al wire: Wedge 0.7 to 3 mil, Ribbon: 0.5x2mil to 1x10 mil,
Au Ball Bonding: 0.7 to 2 mil.
115V, 50/60Hz, 3.2A