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YESTech YTX-3000 Manual X-Ray System

Ref : 2801093-9-GO
Condition : Used
Manufacturer : YESTech
Model : YTX-3000 Manual X-Ray System
Year(s) : 2009
Quantity : 1
Location : Seller or machines location:
AMERICA North (USA-Canada-Mexico)

Pleased to offer this 2009 YESTech YTX-3000 X-Ray Inspection System
, a proven solution for non-destructive inspection of printed circuit boards,
BGAs, CSPs, QFNs, leadless devices, solder joints, hidden interconnects,
and electronic assemblies.

The YTX-3000 was designed specifically for electronics manufacturing
environments requiring affordable, high-quality X-ray inspection
without the complexity and expense of fully automated inline systems.
This system is ideal for EMS providers, contract manufacturers,
OEM electronics facilities, failure analysis labs, prototype departments,
engineering groups, aerospace, military, medical, automotive,
and high-reliability electronics production.

This particular system was manufactured in October 2009 and
includes the original YES X-Ray Software Version 2.2,
operator documentation, and equipped
with a Hamamatsu X-ray imaging assembly.

Key Applications
BGA Inspection
CSP Inspection
QFN Inspection
Leadless Device Inspection
SMT Solder Joint Analysis
Through-Hole Solder Inspection
Voiding Analysis
Solder Bridging Detection
Open Joint Detection
Head-in-Pillow Detection
Hidden Interconnect Inspection
PCB Failure Analysis
First Article Inspection
Process Verification
Rework Verification
Electronics R&D Inspection

System Features
High Resolution X-Ray Imaging
The YTX-3000 utilizes a precision X-ray imaging platform
allowing operators to inspect hidden solder joints and
internal package structures that cannot be evaluated
using traditional optical inspection methods.

Software Package Included
YES X-Ray Software Version 2.2
User Manual Included
Image Capture Functions
Inspection Tools
Measurement Utilities
Defect Documentation Capability

Typical Defects Identified
BGA Defects
Insufficient solder
Excess solder
Missing balls
Bridging
Voids
Cracked joints
Cold solder joints

QFN Defects
Center pad voiding
Wetting issues
Opens
Shorts

SMT Process Issues
Head-in-pillow
Lifted leads
Solder starvation
Excess solder
Internal package defects

Specification Approximate Value
Model YTX-3000
Manufacturer YESTech
Year 2009
Inspection Type Manual X-Ray
Application Electronics Assembly Inspection
X-Ray Source Microfocus X-Ray
Detector Hamamatsu Digital Imaging System
Motion System Motorized XY Positioning
Software YES X-Ray Software v2.2
Power 120 VAC
Power Consumption 1500 Watts Maximum
Operating Mode Off-Line Inspection
Safety Enclosure Fully Shielded Cabinet

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