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Used Grinding, Lapping & Polishing

52 results
1

15 WITH 3 RINGS, AND SLURRY PUMP Location : AMERICA North (USA-Canada-Mexico)

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6

The bundle contains 2X complete tools in decent working condition and 1X tool that is missing a frequency conv Year(s) : 2002 Location : AMERICA North (USA-Canada-Mexico)

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1

Brand: SPEX SPEX SamplePrep 8000M Mixer/Mill "The Spex Mill" Description: SPEX SamplePrep 8000M Mixer/Mill " Location : AMERICA North (USA-Canada-Mexico)

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1

Brand: SPEX SPEX 8000D Dual Mixer/Mill® Grinder, Pulverizer High-Energy Ball Mill, Shaker Mill Description: S Location : AMERICA North (USA-Canada-Mexico)

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1

Brand: Fischione Fischione 1010 Ion Milling and Polishing System Tabletop precision ion milling and polishin Location : ASIA (North East)

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1

Grinding/polishing machine with RotoForce-4 head. The head has 6 spaces for samples, diameter disk: 250 mm, 15 Year(s) : 1999 Location : EUROPE (Western and Northern)

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1

Senko APC 8000 Fiber Optic Polishing System. The APC-8000 features a superior fixture-to-platten locking mecha Location : AMERICA North (USA-Canada-Mexico)

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1

13554 Cross Section Polisher Location : AMERICA North (USA-Canada-Mexico)

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1

Cross Section Polisher Location : AMERICA North (USA-Canada-Mexico)

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1

- Operational - Lots of Extra Spare Parts Location : AMERICA North (USA-Canada-Mexico)

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1

- Fully Operational - Comes w/ Spare Parts - Operations Manual Location : AMERICA North (USA-Canada-Mexico)

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1

6" vacuum wafer chuck vacuum tube with rotary vacuum adaptor dial indicator Location : AMERICA North (USA-Canada-Mexico)

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300mm polishing platten with glass surface integral vacuum manifold single motorized workstation abrasive auto Location : AMERICA North (USA-Canada-Mexico)

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1

maximum substrate 3" diameter includes vacuum tube and chuck Location : AMERICA North (USA-Canada-Mexico)

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High density, cast iron radially serrated lap plate 12” O.D. x 3” Includes: Masterflex L/S Economy Variable-Sp Location : AMERICA North (USA-Canada-Mexico)

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Fully automated, single wafer IPEC polisher designed to accommodate 100 to 200mm diameter wafers. Polisher fea Location : AMERICA North (USA-Canada-Mexico)

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6850 Cryogenic Impact Mill. Uses steel impactor driven by magnetic coils. Requires liquid nitrogen as coolant. Location : AMERICA North (USA-Canada-Mexico)

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1

Machining: Pellet/Polishing machine Year(s) : 2005 Location : ASIA (North East)

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1

squeegee sharpener (grinder) Location : EUROPE (Western and Northern)

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220 V~ / 50 Hz / 0,25 A B (width) 0,18 m / T (depth) 0,43 m H (height) 0,19 m / G (weight) kg polisher / grin Location : EUROPE (Western and Northern)

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1

Rexon belt and disc sander 230 V ~ / 50 Hz / 450 W L (length) 0.54m / W (width) 0.34m H (height) 0.30 m / G ( Location : EUROPE (Western and Northern)

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Application : Lapping/Polishing various wafers - High Rigidity, High Flatness - Table Motion : Rotational Mot Location : ASIA (North East)

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Strasbaugh 7AA Selling "as is, where is." We do not have the ability to test all equipment. This system was d Location : AMERICA North (USA-Canada-Mexico)

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<b>Brand: Premier Mill Model: NETZSCH <u>Particle Grinder</b></u> <b>Details:</b> Used CSD 5/2V Location : AMERICA North (USA-Canada-Mexico)

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2 x Premiere/Nordson 32” Slot die coating heads with heating/cooling lines. These were taken right off their Location : AMERICA North (USA-Canada-Mexico)

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You can find used Grinding, Lapping & Polishing on Wotol

The main manufacturers of Grinding, Lapping & Polishing are Disco, Strasbaugh, Speedfam, Logitech, Lapmaster, Semitool, Buehler, Ebara, Okamoto, Peter Wolters, AMAT, Harig, Premier Mill, Struers, ABB, Advanced Imaging, Branson / IPC, DNS, DS Precision, Fujikoshi, GMN, Leco, NEWLONG, Nitto, Polyflow, Schmoll, Seiko Instruments, Telmec , Ultron

The main model Polyflow S412, HR8500-II, 6EC, 7AA,EPD 300X, Harig EZ SURF, SSG 800 HT, 6DF-SP, 15, UH114, SL13.6, MPS 400, MK II-8, S-LM-116G, OFL-11, Q150GB , 24B, PP5, 1010, Mirra OnTrak, ST260D, DFP8140, S16B, GNX-300, DFG840HS, Rotopol 21,12, MiniMet, Mill NETZSCH, SG-1000HR, 10” web coating.

HS Code 8486 10 50  for Grinding, polishing and lapping machines for processing of semiconductor wafers 

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