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Used Semiconductor Equipment

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1

HF-8 Plasma System LCD Display Dual Mass Flow Controllers Parallel Plate Shelf Optional Rebuilt Dual Stage Vac Location : AMERICA North (USA-Canada-Mexico)

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SEM Location : ASIA (North East)

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Photolithography Location : AMERICA North (USA-Canada-Mexico)

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Inspection/Defect Location : ASIA (North East)

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Insp: Auto X-Ray Inspection System Location : ASIA (North East)

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Auto X-Ray Inspection System Location : ASIA (North East)

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Insp: Auto X-Ray Inspection System Location : ASIA (North East)

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Features: Flexible range. Capable of 1 to 100W operation Greater stability Reproducible conditions Location : AMERICA North (USA-Canada-Mexico)

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Surface roughness measuring machine Year: Model: 2011 Measurement range/resolution: Z axis 800μm/0.01μm, 80 Year(s) : 2011 Location : ASIA (North East)

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○Main specifications ・Product configuration: Atmospheric pressure plasma unit (Type FPE), plasma irradiation r Year(s) : 2015 Location : ASIA (North East)

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Vintage: 12/2018 Benchtop 3D Automated Optical Inspection System Direct Loading Max PCB Size: 520mm Orca Chas Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

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Cylinder cabinet (NH3,NH3) Year(s) : 1993 Location : ASIA (North East)

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Taping machine Year(s) : 1994 Location : ASIA (North East)

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Full 3D Inspection (Actual 3D) Inspection Irrelevant to Color, Material, Surface Roughness Foreign Material & Year(s) : 2022 Location : AMERICA North (USA-Canada-Mexico)

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Tape peeling machine Year(s) : 1998 Location : ASIA (North East)

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Dry etching system (SiO2) Year(s) : 2011 Location : ASIA (North East)

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Diffusion furnace (OX) Year(s) : 2000 Location : ASIA (North East)

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Diffusion furnace (SOG bake) Year(s) : 1994 Location : ASIA (North East)

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Fume hood Year(s) : 1989 Location : ASIA (North East)

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Wafer Size 4 Year(s) : 2012 Location : ASIA (North East)

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DICING SAW WITH SPLIT FIELD MICROSCOPE 6″ CAPABILITY Location : AMERICA North (USA-Canada-Mexico)

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DICING SAW, 6X12″ CUTTING AREAIDEAL FOR CUTTING HARD MATERIALS Location : AMERICA North (USA-Canada-Mexico)

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WAFER BONDER, BONDS RUBBER DISC TO WAFERS UP TO 6″ PRIOR TO DICING, SCRIBING Location : AMERICA North (USA-Canada-Mexico)

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GOLD TIN REFLOW SYSTEM Location : AMERICA North (USA-Canada-Mexico)

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Maximum Board Size: 18” x 22” (458mm x 560mm) Minimum Component Size: 0.010” (0.25mm) 1.6 kW Focused Convectio Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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