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Used Semiconductor Equipment

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1

Wafer Size Range Minimum 50 mm Maximum 150 mm Set Size 150 mm Alignment Optics Splitfield Video So Location : AMERICA North (USA-Canada-Mexico)

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ILX 1000 Inline X-Ray System Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

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Strip Etch Tinstrip line, line length 18,1m, direction R-L, max working width 650mm, max panel 640mm x 532mm,| Year(s) : 2006 Location : EUROPE (Western and Northern)

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2 sets that are still installed in the fab unit 1- Description of Alpha 8 SEi 8" - Year Manufactured: 2001 - Year(s) : 2001, 2002 Location : ASIA (North East)

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Details - Anly H8DA Counter/Timer - Omron H7ET Lamp Operator Location : AMERICA North (USA-Canada-Mexico)

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- Downstream or Direct Plasma Asher - Microprocessor controlled - Two gas inputs plus Nitrogen input - Flow Me Location : AMERICA North (USA-Canada-Mexico)

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PILL Ätz- und Strippanlage Location : EUROPE (Western and Northern)

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8626 Negative Developer Location : AMERICA North (USA-Canada-Mexico)

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8626 Coater Location : AMERICA North (USA-Canada-Mexico)

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Precision 5000 Location : AMERICA North (USA-Canada-Mexico)

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10

Location : ASIA (North East)

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4450 HOT SHOT HOT GAS BONDER WITH STEREO ZOOM OPTICS AND FOCUS MOUNT INCLUDES: HEATED WORKHOLDER Location : AMERICA North (USA-Canada-Mexico)

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Peristaltic type precision dispenser with hand held needle, adjustable speed with direction reverse, DIGITAL t Location : AMERICA North (USA-Canada-Mexico)

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4700E Wedge Bonder Can be converted to Ball Bonder Does Not Include Ball Bonder head Location : AMERICA North (USA-Canada-Mexico)

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454630E-79 automatic wire bonder 90 degree vertical feed, motorized. Location : AMERICA North (USA-Canada-Mexico)

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EPOXY DIE BONDER WITH NEW COLOR VIDEO CAMERA AND CROSS HAIR Location : AMERICA North (USA-Canada-Mexico)

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Model Periplan GF Magnification 10 X Field Number 18 mm Focusing YES Motorized Nosepiece YES Multip Location : AMERICA North (USA-Canada-Mexico)

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Exterior Dimensions Width 40.157 in (102.0 cm) Depth 44.094 in (112.0 cm) Height 59.055 in (1 Year(s) : 2017 Location : EUROPE (Western and Northern)

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*. Process: Film thickness measurement. - silicon dioxide on silicon 400~ 30,000 A. - photo resist on silicon Year(s) : 1996 Location : ASIA (North East)

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*. Process: Film thickness measurement. - silicon dioxide on silicon 400~ 30,000 A. - photo resist on silicon Year(s) : 0 Location : ASIA (North East)

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[ General Description ] Wafer Size : 2 ~ 6 inch Illumination Source : 25 mW laser, 405 nm wavelength Operator Year(s) : 2006 Location : ASIA (North East)

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APM Skinpack e Blister Location : EUROPE (Western and Northern)

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XL1 Location : EUROPE (Western and Northern)

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(Was an XD7500 converted to a XD7600-NT-250 sealed tube system by Dage) 160kV Max. Board Size: 508 x 444mm Max Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

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Lightly Used Inline AOI Large Board: 21”x21” Max Inspection Area: 21”x21” Min Inspection Area: 2”x2” Linear Mo Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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