Accretech UF200

Wafer Size Range
Minimum 150 mm
Maximum 200 mm
Number of Cassette Elevators 2
Wafer Handling Random Access Robot
Accuracy ± 2.00 %

Vacuum Chuck
Diameter 7.8740 in (200.00 mm)
Plating Material Nickel/Gold

Temperature Controlled Chuck YES
Automatic Alignment YES
OCR Camera YES
Probe Mark Inspection YES
Software Revision Level 6G.16.AB
Interface IEEE 488-GPIB
Condition Good
Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase
CE Marked YES
External Cooling Air Cooled
Operating Air Pressure 58.00 PSI (399,927.40 N/sq m)
Air Consumption 10.00 CFM (0.28 cu m/min)
Vacuum Required -23.00 in Hg (-584.19 mm Hg)

Exterior Dimensions
Width 42.992 in (109.2 cm)
Depth 43.346 in (110.1 cm)
Height 34.921 in (88.7 cm)
Weight 1,764 lb (800 kg)

Shipping Weight 2,204.59 lb kg