ADE 9350, UltraScan

Brand: ADE
Model: UltraScan 9350
Wafer Inspection / Sorter System
Non-contact capacitive probe measurement
with 10nm resolution, 400 to 1000 microns wafer thickness range

Used
Details:
Capable of handling 100mm to 200mm wafers
2 cassette input stations
3 cassette output stations
Pre-aligner station
High Res resist station
Flatness station
Single end effector robot
Ultrascan controller,
9300 power supply,
350 arm controller,
Unix computer and drive,
ASC II,
Teal power conditioner
Non-contact capacitive probe measurement with 10nm resolution,
400 to 1000 microns wafer thickness range,
Capable of handling 100mm to 200mm wafers.
Capable of measuring: lapped, etched, polished and patterned wafers
Measures bow and warp, site and global flatness, thickness.