Datacon 2200 evo Bonder

- Software Version: on request
- Operating System: on request
- Condition: Refurbished
- Wafer Mapping: Yes
- Single Component Tracking: Yes
- Bondhead (Main System): Standard
- Time-Pressure Dispenser (Main System): Yes
- Volumetric Dispenser (Main System): no / on request
- Musashi Dispenser (Main System): no / on request
- Substrate Camera (Main System): Yes
- Toolbank (Main System): Yes, 7 positions
- Squeegee Unit (Main System): no / on request
- Flipchip Unit (Main System): no / on request
- Fluxslider (Main System): no / on request
- Wafertable: Yes, 6 to 12 inch
- Wafer Magazine Lift: Yes
- Wafer Camera: Yes
- Ejector System: Yes
- Ejector Carrousel: Yes
- Up-looking Camera: Yes
- Static Wafflepack Holder: no / on request
- Bondhead (ID System): No
- Time-Pressure Dispenser (ID System): Yes
- Volumetric Dispenser (ID System): no / on request
- Musashi Dispenser (ID System): no / on request
- Substrate Camera (ID System): Yes
- Squeegee Unit (ID System): No