Datacon 2200 EVO Die Bond
Ref :
2712133-9-CP
Condition :
Used
Manufacturer :
Datacon
Model :
2200 EVO
Short Description :
Die Bond
Year(s) :
2012
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Condition Refurbished
Heated bondhead
Wafer strecher
Flip unit
Tool bank
Other machines similar to Datacon 2200 EVO Die Bond
1
Datacon 2200 APM Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2003
1
3 Datacon 2200EVO Flip Chip Bonder
Location :
South Korea
Year(s) :
2007
1
Datacon 2200 EVO Die Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2011
1
Datacon 2200 EVO Die Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2014