EVG 620, Automated Mask Alignment System

Brand: EVG
Model: 620
AUTOMATED MASK ALIGNMENT SYSTEM

Specifications
• Used
• High resolution top and bottom side splitfield microscopes
• Handling of multiple wafer sizes with quick change-over time
• High degree of automation (multiple send/receive cassettes)
• Manual substrate loading capability on automated system
• Windows® based user interface
• Cassette-to-cassette handling system
• Automatic alignment
• Field upgradeable from manual to fully-automated version
• NanoAlign® package for enhanced process capabilities
• Thin or warped wafer handling
• Nanoimprint lithography and micro contact printing
• Bond alignment
• Simulation software for mask aligner lithography process