Finetech Fineplacer Lambda Sub-Micron Die bonder

Ref : 2732055-9-W

Condition : Used

Manufacturer : Finetech

Model : Fineplacer Lambda Sub-Micron

Short Description : Die bonder

Year(s) : 2017

Quantity : 1

Location : Seller or machines location:
EUROPE (Western and Northern)

Includes:
FINEPLACER lambda
Bonding force module FD3
Chip heating module
Optional Dispensing Module FG3
WinFlipChip software version 3.2 Revision 052 and PC

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