1/1
Finetech Fineplacer Lambda Sub-Micron Die bonder
Ref :
2732055-9-CP
Condition :
Used
Manufacturer :
Finetech
Model :
Fineplacer Lambda Sub-Micron
Short Description :
Die bonder
Year(s) :
2017
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Includes:
FINEPLACER lambda
Bonding force module FD3
Chip heating module
Optional Dispensing Module FG3
WinFlipChip software version 3.2 Revision 052 and PC
Other machines similar to Finetech Fineplacer Lambda Sub-Micron Die bonder
1
Tosok DBD4600 Automatic Epoxy Die Bonders
Location :
EUROPE (Western and Northern)
Year(s) :
2014
1
Tosok DBD4600 Automatic Epoxy Die Bonders
Location :
EUROPE (Western and Northern)
Year(s) :
2011
1
Tosok DBD4600 Automatic Epoxy Die Bonders
Location :
EUROPE (Western and Northern)
Year(s) :
2015
1
F&K Delvotec 6400 Bonding
Location :
EUROPE (Western and Northern)
Year(s) :
2003