1/1
Finetech Fineplacer Lambda Sub-Micron Die bonder
Ref :
2732055-9-CP
Condition :
Used
Manufacturer :
Finetech
Model :
Fineplacer Lambda Sub-Micron
Short Description :
Die bonder
Year(s) :
2017
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Includes:
FINEPLACER lambda
Bonding force module FD3
Chip heating module
Optional Dispensing Module FG3
WinFlipChip software version 3.2 Revision 052 and PC
Other machines similar to Finetech Fineplacer Lambda Sub-Micron Die bonder
1
ASM Harrier Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2009, 2010
1
West Bond 545657B Convertible Semi-Automatic
Location :
EUROPE (Western and Northern)
1
ASM AD809M-06 Die Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2002
1
Micro Point Pro Ibond 5000D Ball Bonder
Location :
AMERICA North (USA-Canada-Mexico)