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Finetech Fineplacer Lambda Sub-Micron Die bonder
Ref :
2732055-9-C
Condition :
Used
Manufacturer :
Finetech
Model :
Fineplacer Lambda Sub-Micron
Short Description :
Die bonder
Year(s) :
2017
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Includes:
FINEPLACER lambda
Bonding force module FD3
Chip heating module
Optional Dispensing Module FG3
WinFlipChip software version 3.2 Revision 052 and PC
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