FRT Formfactor-Camtek MicroProf 300 Automated Optical Profiler

The FRT MicroProf 300 is a highly versatile,
standalone 3D optical surface metrology tool
primarily used for non-contact, non-destructive wafer testing
and material characterization.
Manufactured by the FRT Metrology division under Camtek
(and previously FormFactor), it serves as the core
measurement platform across global semiconductor,
MEMS, medical, and packaging foundries.

Core Technical Specifications
Measurement Area: Features a fast, high-precision XY stage moving up to
415 mm x 305 mm, making it perfectly optimized for handling 300 mm
(12-inch) semiconductor wafers.
Resolution: Delivers fast 3D surface mapping down to sub-nanometer vertical resolution.
Frame Construction: Built on a heavy, stable granite base that
provides excellent vibration damping to ensure pristine measurement repeatability.
Height Stitching: Equipped with a motorized Z-axis and
software-driven vertical stitching to seamlessly expand the vertical measuring window.

Key Capabilities & Applications
Surface Topography & Roughness: Maps 2D and 3D roughness, waviness,
and contours conforming strictly to DIN-ISO and SEMI industrial standards.
SurfaceSensTM Hybrid Multi-Sensor Setup: Allows simultaneous configuration of
multiple optical sensors—including chromatic white light (CWL) point sensors,
white light interferometry (WLI), field-of-view (FoV) sensors, and film thickness sensors.
Total Thickness Variation (TTV): Supports retrofitted dual-sided inspection modules
with top and bottom CWL sensors to calculate overall wafer thickness, warp, bow, and TTV.
Layer & Defect Inspection: Non-destructively determines film thickness and
flags structural imperfections like voids, cracks, delamination, or bumps.