KLA ASET-F5x UV Film Thickness Tool

KLA-TENCOR ASET-F5x Thin Film Measurement System
Manufactured in June, 2002
Inspection Modes Include:
Dual Beam Spectrometry
Spectroscopic Ellipsometry
Film Stress Analysis
SUMMITTM Application Software Version 3.21.16
FTML Version 3.46.06
Model 300DFF1P Wafer Loading Platform
Dual Loadports for 300mm Wafers
Three Axis Wafer Handling Robot
GEM / SECS Communication

Wafer Size Range Minimum 200 mm Maximum 300 mm Set Size 300 mm
Illumination Source Type Multi-wavelength Source
Multi-Layer Film Capacity YES
Micro Spot Optics YES
Scanning Stage YES
Wafer Mapping YES
Software Revision Level SUMMIT 3.21.16
Condition Excellent
Refurbished YES
CE Marked YES