KLA-Tencor 2131 Defect Inspection System

1x, KLA-Tencor 2131 Defect Inspection System

The KLA-Tencor 2132 is a wafer defect inspection system.
Features:
Defect clustering and auto review
Sampling blanket wafer inspection
Automated inspection - automatic focusing
SECS - GEM
Fully automatic, non-contact wafer alignment.
Accommodates SEMI standard 25 wafer cassettes
Uses pick-and-place, random access wafer handling system
Specifications:
Capable of inspecting at the following rates:
Speed: 5 sec/cm2 Sensitivity: 0.62
Speed: 15 sec/cm2 Sensitivity: 0.30
Speed: 30 sec/cm2 Sensitivity: 0.25
Wafer inspection module for 4, 5, 6, or 8 inch wafer size.
Minimum inspectable feature size of 0.25µm
in DIE to DIE mode