KLA-Tencor AIT I (8020)

1x, A double darkfield patterned wafer inspection tool.


Features:
Automated wafer inspection system
Double-dark field (DDF) laser scanning technology
High detection sensitivity even for difficult after-etch
develop, and chemical mechanical polishing
Able to detect planar defects, microscatches
and particulate contamination
System capable of full wafer inspection.
Specifications:
Can detect particles as small as 0.10 micrometers
on bare silicon and patterned process wafers.
High throughput of up to 30 full wafer scans
per hour on 1500mm wafers
90 percent system to system matching
map to map.