KLA-Tencor AIT I In-Line Defect Inspection System

1x, KLA-Tencor AIT I In-Line
Defect Inspection System

Automated full water inspection system for detecting particles
as small as 0.10 micrometers on bare silicon
and patterned process wafers

Features:
High detection sensitivity even for difficult after-etch
develop, and chemical mechanical polishing.
Double-dark field (DDF) laser scanning technology
the AIR is able to detect planar defects, microscratches
and particulate contamination.
which combines a low angle of illumindation with multiple collection
optics placed close to the wafer horizon-maximizing the capture
of defects while minimizing the capture of surface scatter.
Exceptional defect sensitivity
Reduced laser spot size concentrates the laser beam at the site
of the defect, causing more light to scatter off the defect
and less light to scatter off pattern and surrounding surface.
High speed CMP monitor
A Process Variation Removal (PVR) algorithm that automatically
compensates for variations in background scattering intensity caused
by film non-unformities - dramatically increasing defect capture
while minimizing false counts.
Integrated microscope capabilities to speed recipe optimization
and defect classication.
Intergrated classification and analysis.
Specifications:
High throughput of up to 30 full wafer scans
per hour on 150mm wafers