KLA-Tencor FleXus FLX 2320

1x, KLA-Tencor FleXus FLX 2320

Thin-film stress measurement instrument
that measures the changes in the radius
of curvature of a wafer caused by the deposition
of a stressed thin film.
Features:
Laser scanning to measure stress on all reflecting films.
Measures and displays stress as a function of time.
Comprehensive data analysis capabilities that include
trend plotting for statistical process control (SPC)
and displaying a 3-D map of wafer deflection over the entire surface.
Used for calculation of biaxial modulus of elasticity and linear expansion
water diffusion coefficient in dielectric films, linear regression and stress-temp
or stress-time gradients.
Provides analysis of thin film stress with very low measurement noise
and allows observation and quantitative evaluation of stress relaxation
oxide densification, thin film phase transformations and annealing.
Specifications:
Up to 6" wafer capability
System power: 230V, 50/60Hz, 1PH, 30Å