KLA-Tencor FLX-2300 FleXus

1x, KLA-Tencor, FLX-2300 FleXus

Thin-film stress measurement instrument that measures
the changes in the radius of curvature of a wafer caused
by the deposition of a stressed thin film.


Features:
Laser scanning to measure stress on all reflecting films.
Measures and displays stress as a function of time.
Comprehensive data analysis capabilities that include trend plotting
for statistical process control (SPC) and displaying a 3-D map
of wafer deflection over the entire surface.
Used for calculation of biaxial modulus of elasticity
and linear expansion, water diffusion coefficient in dielectric films
linear regression and stress-temp or stress-time gradients.
Provides analysis of thin film stress with very low measurement noise
and allows observation and quantitative evaluation of stress relaxation
oxide densification, thin film phase transformations and annealing.