Kurt J. Lesker PVD 150

• Deposition Technique: Magnetron sputtering
• Sputter Source: TORUS sources
• Maximum Round Substrate Size: 6 in (150 mm)
• Maximum Square Substrate Size: 4 × 4 in (100 × 100 mm)
• Vacuum Chamber: UHV-grade
• Backing Pump: Oil-free
• Cryopump: CTI cryopump
• Base Pressure: 2 × 10−7 mbar
• Control Software: PC graphical interface
• Recipe Creation: Automated
• Process Control: Real-time monitoring and control
• Glove Box Compatibility: Vacuum chamber can be mounted to a glove box
• Voltage: 208 V
• Phase: Three phase
• Frequency: 60 Hz