Lam Research 2300 Dielectric/Metal Etch Tool

LAM RESEARCH 2300 Dielectric/Metal Etch Tool
2300 Platform V2 Etch Transfer Module
3ea 200mm Open Cassette Loadports
Front & Side User Interface Monitors
CDM Wafer Handling Robot
2300 Exelan Flex45 Dielectric Etch Process Module
OES 2 End Point Detection
Low Temperature ESC
Boce 2700 LPM Turbo Pump
16 Regulated Gas Channels
Versys HP Metal Etch Process Module
OES 2 End Point Detection
Boce 2200 LPM Turbo Pump
16 Regulated Gas Channels
Microwave Stripper Process Module
On Board Gas System
3 Regulated Gas Channels
Manufactured in 2023
Unused Since Installation/Qualification
All Pumps, Generators & Other Subsystems Included

Wafer Size Range
Minimum 200 mm
Maximum 300 mm
Set Size 200 mm

Number of Chambers 3
Process Capabilities Dielectric Etch/Metal Etch/Microwave Strip
CE Marked YES
Condition Like New