Micro Point Pro Ibond 5000D Ball Bonder

Provides the High Yields and Excellent Repeatability Needed for
All Gold Ball Bonding Applications Including:

Optoelectronic modules
Hybrid/MCMs
Microwave products
Discrete devices/lasers
Semi-Automatic/Manual Mode with ‘Z’ Option

‘Z’ Axis DC Servo Motion with Closed-Loop Control
Consistent Ball Size Via Negative Electronic Flame-Off
Missing Ball Detection & Auto-Stop
Deep Access Capability
Built-In Temperature Controller
Various Microscope and Spotlight Targeting Options Available
Large 6” x 6” Bonding Area
Variety of Wire Types: Gold & Copper (with copper kit option)
Chessman/Mouse & Manual ‘Z’ Convertible Right or Left
Ball Bonding, Bumping, Coining, Security Bond & Tab