Mycronic PI Pico M 3D SPI

DOM: 12/19/2022
3D Vision – 80 Mpixel 3D system (16 cameras, 4 projectors):
Distortion free 3D triangulation system
High power RBG LED lighting for 3D Color Image
15 μm resolution
Max. paste height measurement: 400 μm

Hardware:
Min. PCB dimensions (L x W): 50×50 mm / 2″ x 2″
Max. PCB dimensions (L x W): 533 x 533 mm / 21″ x 21″
PCB thickness range: 0.1- 5 mm.
Edge clearance: 3 mm.
Max. PCB warp : +/- 5 mm.
Embedded photometric and geometric calibration tools.
Standard conveyor length: 1000 mm (800 mm option).

Measurement – Insufficient paste, excessive paste, bridge, missing paste, shape deformity:
Volume, height, area, deposit offset, global offset.
User defined defect created by a meta-rule.
eSPC including X-R charts, process signature, manual close loop tools.
Operating System – Linux, including 3 levels of password protection.
Power supply – 100-240 VAC / 16 A, Single Phase, 60 Hz
Size (W x D x H) & weight – 1000 x 1296 x 1932 mm, 430 kg