Plasmatherm Dual SLR ICP

Plasmatherm SLR ICP Shuttle Lock ICP Inductively
Coupled Plasma Etch System.
PC controller.
Vacuum load lock with wafer transfer robot.
Can process wafers from 2” to 8” depending on
which process kit is installed.
Currently configured with 4” kit.
High frequency RF-based inductively coupled plasma source capable of
high density plasma generation.
Closed loop pressure control.
Turbo pump with roughing pump.
Total of eight MFC gas controllers.
Includes water chiller and roughing pump. 208V, 3Ph, 60Hz