Plasmatherm VLR 700

• Wafer Size Minimum: 50 mm
• Wafer Size Maximum: 200 mm
• Set Size: 100 mm
• Number of Chambers: 1
• Process Capability: nitride deposition
• Electrode Size: 13.5 inch
• Gas Delivery Channels: 6
• Gas Flow Capacity: 2000 sccm (2 channels)
• Gas Flow Capacity: 1000 sccm (2 channels)
• Gas Flow Capacity: 200 sccm (1 channel)
• Gas Flow Capacity: 20 sccm (1 channel)
• Controller Type: PC controller
• Temperature Control Method: thermocouple
• External Cooling: water cooled
• Vacuum Pump Package: Leybold
• Chiller: Neslab HX 75
• Control Computer: dual boot VxWorks Wind River Systems 5.3.1 BSP 1.1/1
• Control Computer: Windows 3.11 System Monitor VLR v1.10
• Secondary Computer: NT4
• Software: Versaworks 2.5