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Used Grinding, Lapping & Polishing

56 results
1

Variable Speed Grinder Polisher. Polishing Wheel: 8”. Variable speed from 50 to 500 rpm. LED display. Constant Location : AMERICA North (USA-Canada-Mexico)

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Polisher Grinder with Vector LC Power Head. Buehler Metaserv 3000 single plate automatic polishing machine wit Location : AMERICA North (USA-Canada-Mexico)

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Struers Multidoser for automatic dispension of polishing suspensions and slurries. 220V, 3Ph, 60Hz, 5.3A Location : AMERICA North (USA-Canada-Mexico)

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Fully-Auto LED Wafer Prober Year(s) : 2011 Location : ASIA (North East)

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SW-08 Year(s) : 2010 Location : ASIA (North East)

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Wafer Polishing Machine Year(s) : 2011 Location : ASIA (North East)

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GAN Grind Machine Year(s) : 2012 Location : ASIA (North East)

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DFG-83H/6 Description Back side grinder Year(s) : 1994 Location : ASIA (North East)

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24B Description Polisher Year(s) : 2000 Location : ASIA (North East)

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TISI ID 150901-48 Manufacturer Semitool Model Spectral Description Poly Strip Wafer Size 200mm Vintage 7 Location : ASIA (North East)

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TISI ID 150917-200 Manufacturer DISCO Model DFG8140 Description Back side polisher DFG8140 Wafer Size 8" Location : ASIA (North East)

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TISI ID 151013-223 Manufacturer SPEEDFAM Model 32 DPAW Description Wafer Polishing Machine Location : ASIA (North East)

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It is now deinstalled. The tool was installed and initialized before being deinstalled due to a project canc Year(s) : 2007 Location : EUROPE (Western and Northern)

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- Was Fully Operational in the USA before removal - Comes with a supply of some Spare Parts - Includes a hard- Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

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Semi-Automatic Grinder Polisher Location : AMERICA North (USA-Canada-Mexico)

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13554 Cross Section Polisher Location : AMERICA North (USA-Canada-Mexico)

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Cross Section Polisher Location : AMERICA North (USA-Canada-Mexico)

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15 WITH 3 RINGS, AND SLURRY PUMP Location : AMERICA North (USA-Canada-Mexico)

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Specifications: Resolution: 1µm Full range accuracy (at 20°C): 3µm over 25mm Max allowable preset value: Location : AMERICA North (USA-Canada-Mexico)

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Specifications: Workpiece material: Glass Max substrate: 300mm X Axis Specifications: Stroke: 300mm S Location : AMERICA North (USA-Canada-Mexico)

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General Specifications: Table diameter: 300mm Max. workpiece size: 400mm dia x 200mm H Table revolution speed: Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Fully Automatic Wafer Back Grinder Version: 200 MM Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

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Fully Automatic Wafer Back Grinder Version: 200 MM Vintage: 01.06.2004 The equipment has been professionally d Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

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SHODA MVC-630BII Location : EUROPE (Western and Northern)

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Main Axis is not operational. Year(s) : 1999 Location : EUROPE (Western and Northern)

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You can find used Grinding, Lapping & Polishing on Wotol

The main manufacturers of Grinding, Lapping & Polishing are Disco, Strasbaugh, Speedfam, Logitech, Lapmaster, Semitool, Buehler, Ebara, Okamoto, Peter Wolters, AMAT, Harig, Premier Mill, Struers, ABB, Advanced Imaging, Branson / IPC, DNS, DS Precision, Fujikoshi, GMN, Leco, NEWLONG, Nitto, Polyflow, Schmoll, Seiko Instruments, Telmec , Ultron

The main model Polyflow S412, HR8500-II, 6EC, 7AA,EPD 300X, Harig EZ SURF, SSG 800 HT, 6DF-SP, 15, UH114, SL13.6, MPS 400, MK II-8, S-LM-116G, OFL-11, Q150GB , 24B, PP5, 1010, Mirra OnTrak, ST260D, DFP8140, S16B, GNX-300, DFG840HS, Rotopol 21,12, MiniMet, Mill NETZSCH, SG-1000HR, 10” web coating.

HS Code 8486 10 50  for Grinding, polishing and lapping machines for processing of semiconductor wafers 

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