Surface Technology Systems (STS) MXP Multiplex ICP ASE HR
AMERICA North (USA-Canada-Mexico)
Wafer Size Range
Minimum 50 mm
Maximum 200 mm
Set Size 150 mm
Process Silicon Etch Bosch Process
Loadlock
Loadlock Yes/No YES
Loadlock Pump Manufacturer & Model Edwards E2M40
High Vacuum Pump Pfeiffer MAG 2000
Roughing Pump Edwards IQMB250 & IQDP80
RF Generator Model ENI/ACG-3B and Advanced Energy RFG 3001
Number of Gas Inputs Four Gas
Process Gases SF6, C4F8, O2, Ar
Chillers
Number of Chillers 1
Chiller #1Manufacturer/Model Huber/Unistat 140W
Accessories
ICP V2 - Balun coil
Mechanical Clamp
Helium Backside Cooling
Carousel in MkIV MPX - 2 x 150mm wafers
3KW Source
300/30W platen
E-Rack Modules: HCL1 +HCU3 +HCU5+VAC3Y +2x AMC1 +HBC2
Other Information
Windows 2000
Bosch license
Current Power Requirements: 400V , 50Hz, 40 Amp, 3 phase
Unit can be configured for: 208/460, 60 Hz, 3 Phase. Please request at time of purchase.
CE Marked YES