Veeco RF-350 Ion Beam Etching System

Veeco RF-350 Ion Mill is a high-precision, automated,
single-substrate loadlocked production system (or configurable to cassette-to-cassette)
designed for ion beam etching (IBE) and Reactive Ion Beam Etching (RIBE).
It features a 300mm diameter, inductively coupled, filamentless RF ion source that
offers exceptional uniformity, versatility, and controllable etch rates for
applications in MEMS, semiconductor fabrication, and data storage.

Key features of the Veeco RF-350 include:
Ion Source & Performance: Uses a 300mm diameter, inductively coupled,
RF-driven ion source that provides highly collimated beams, allowing for
precise control over etch rate, uniformity, and incident angle.
Process Versatility: Supports both Ion Beam Etching (IBE) and
Reactive Ion Beam Etching (RIBE), with the capability for CAIBE
(Chemically Assisted Ion Beam Etching)
Material Handling: Capable of processing various materials, including metals, ceramics,
and semiconductors, with high-aspect-ratio features.
System is configured for single 6” wafer loading.