Used Semiconductor and PCB Manufacturing
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TEOS 2Ch, Sputter 2Ch / 4C/H Wafer Size 8" Year(s) : 2000 Location : ASIA (North East)
Price : On request
More detailsTISI ID 151013-172 Manufacturer Wei Min Model LED-617HC Description Tester Wafer Size Vintage 12-31-10 Location : ASIA (North East)
Price : On request
More detailsTISI ID 150815-60 Manufacturer AMAT Model P5000 CVD+Etch Description TEOS 3Ch, Etch 1Ch / 4C/H Wafer Size Location : ASIA (North East)
Price : On request
More detailsTISI ID 11624 Manufacturer TEL Model TE 5480 Description Plasma Reactive Ion Etch System Location : ASIA (North East)
Price : On request
More detailsTISI ID 11617 Manufacturer Steag(Hamatech) Model B0159 Description Mask Cleaner Location : ASIA (North East)
Price : On request
More detailsTISI ID 11618 Manufacturer Suss Model MA 150M Description Mask Aligner, Cassette to Cassette Location : ASIA (North East)
Price : On request
More detailsTISI ID 150724-27 Manufacturer AMAT Model P5000 (2CVD / 1 ETCH) Description Wafer Size 8" Location : ASIA (North East)
Price : On request
More detailsTISI ID 150724-25 Manufacturer AMAT Model EMAX CT_2CH Description Wafer Size 12" Location : ASIA (North East)
Price : On request
More detailsTISI ID 150724-26 Manufacturer AMAT Model DPS G3_3CH Description Wafer Size 12" Location : ASIA (North East)
Price : On request
More detailsOrthodyne 20 Wedge Bonder with Workholder & Optics Capable of using wire up to 20 mil Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMech El 909 Wedge Bonder with Workholder & Optics Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsK&S 472 Ball Bonder with Heated Workholder & Optics Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsTISI ID 150829-58 Manufacturer HP Model 8514B Description S-PARAMETER TEST SET Location : ASIA (North East)
Price : On request
More detailsTISI ID 11250 Manufacturer Mattson Model Aspen II Description Asher, 1CH(Non-ICP) Wafer Size 200mm Vintag Location : ASIA (North East)
Price : On request
More detailsTISI ID 11255 Manufacturer Kaijo Model BOE Frontend Description BOE Wet Station Wafer Size 200mm Vintage Location : ASIA (North East)
Price : On request
More detailsTISI ID 11396 Manufacturer Semitool Model SRD-270F Description Spin dryer Location : ASIA (North East)
Price : On request
More detailsTISI ID 11404 Manufacturer KLA Tencor Model SFS 7600 Description 8", 2 cassette stage Wafer Size 200mm Vi Location : ASIA (North East)
Price : On request
More detailsBrand: KE TISI ID 150815-200 Manufacturer KE Model DJ-853V-8DL Description Furnace Location : ASIA (North East)
Price : On request
More detailsBrand: Daesung TISI ID 20151215-56 Manufacturer DAESUNG Model DSP-3300V Description SCREEN PRINTER Location : ASIA (North East)
Price : On request
More detailsPanasonic, CM602L Chip Mounter Description Model : NM-EJM8A 12 segment high speed head , Type A2 Flow Direc Location : ASIA (South East)
Price : On request
More detailsPanasonic, CM402-M Chip Mounter Features - High Speed Head 0.06sec/chip - Placement Accuracy ±50 µm / chip - Location : ASIA (South East)
Price : On request
More detailsPanasonic, CM402-M Chip Mounter Features - High Speed Head 0.06sec/chip - Placement Accuracy ±50 µm / chip - Location : ASIA (South East)
Price : On request
More detailsJuki, KE750 Pick and place Features High Speed Flexible Chip Mounter c/w Nozzle change c/w HMS ( Height meas Location : ASIA (South East)
Price : On request
More detailsPanasonic, CM212A Chip Mounter Features - High Speed Head 0.065sec/chip 55 300 cph - Placement Accuracy ±50 µm Location : ASIA (South East)
Price : On request
More detailsPanasonic, CM212A Chip Mounter Features - High Speed Head 0.065sec/chip 55 300 cph - Placement Accuracy ±50 µm Location : ASIA (South East)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14