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Used Semiconductor and PCB Manufacturing

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YIELD ENGINEERING YES-310 VAPOR PRIME OVEN consisting of: - Model: YES-310 - HMDS Vapor Prime and Vacuum Bake Location : AMERICA North (USA-Canada-Mexico)

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Machine Type: High-speed SMT placement machine / chip shooter Application: SMT PCB assembly, high-speed chip p Year(s) : 2020 Location : AMERICA North (USA-Canada-Mexico)

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Machine Type: Fully Automatic SMT Stencil Printer Application: High-precision solder paste printing for SMT PC Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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Machine Type: Smart Fast Modular SMT Placement Machine Application: High-mix / high-speed SMT PCB assembly Ke Year(s) : 2021 Location : AMERICA North (USA-Canada-Mexico)

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Hanwha SM481 Pick and Place YOM: 2018 10 spindle head Front and rear trolleys included with machine. Feed Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

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Parmi SigmaX L 3D SPI DOM: 10/20/2017 Key Specifications: Maximum PCB Size: 580 mm x 510 mm Maximum PCB We Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

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Pemtron ATHENA L 3D AOI DOM: 3/15/2023 Max board size: 510 x 510 mm Board thickness: .4 - 7.0mm PCB Clearance Year(s) : 2023 Location : AMERICA North (USA-Canada-Mexico)

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Pemtron TROI-7700HL 3D SPI DOM: 9/5/2014 Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

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SMEMA Compliant Volts: 110 Phase: Single Amps: 6.95 Hertz: 50/60 PSI: 65 Board Flow Direction: Left to Right Year(s) : 2021 Location : AMERICA North (USA-Canada-Mexico)

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Screen Printer Model X5 Location : AMERICA North (USA-Canada-Mexico)

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Hesse BJ820 Vers. 1 Current configuration: Wedge-wedge, Bondhead 60° e-box Year(s) : 2008 Location : EUROPE (Western and Northern)

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ENCLOSED FOR MICROWAVE APPLICATIONS MITUTOYO MICROSCOPE WITH 2 OBJECTIVES SEMI AUTOMATIC, JOYSTICK CONTROL (NO Location : AMERICA North (USA-Canada-Mexico)

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Hesse BJ820 Vers. 1 Current configuration: Wedge-wedge, Bondhead 60° e-box Year(s) : 2008 Location : EUROPE (Western and Northern)

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Vintage : MAY 2013 Left to Right Board Flow Specifications ( See Details above for installed options ) STANDA Year(s) : 2013 Location : AMERICA North (USA-Canada-Mexico)

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Vintage : OCT 2013 Model: CCS-1M-4-SBS-SCSD-0640 Left to Right Board Flow 20" Max Board Width Dual Lane Capabl Location : AMERICA North (USA-Canada-Mexico)

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Specifications Method: Heater and ceramic fiber furnace body are integrally molded. Shelves: None Temperature Year(s) : 2016 Location : ASIA (North East)

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Method: Forced hot air circulation/ventilation system Shelves: 2 Temperature range: (Ambient temperature + 20℃ Year(s) : 2007 Location : ASIA (North East)

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Method: Forced Hot Air Circulation/Ventilation System Shelf: 1 Temperature Range: (Ambient Temperature + 20℃) Year(s) : 2020 Location : ASIA (North East)

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SPECS: I.D. 24"W X 24"D X 24"H O.D. 40"W X 61"D X 77"H Temperature Range: -70 to +170 Deg. C 20% to 95% Humidi Location : AMERICA North (USA-Canada-Mexico)

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Stepper Wafer Size 200MM Year(s) : 1994 Location : ASIA (North East)

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Stepper Wafer Size 200MM Year(s) : 1997 Location : ASIA (North East)

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Traack Wafer Size 300mm Year(s) : 2011 Location : ASIA (North East)

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Wafer Size 300MM Year(s) : 2004 Location : ASIA (North East)

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I.D. 24"W X 24"D X 24"H O.D. 40"W X 61"D X 77"H Temperature Range: -70 to +170 Deg. C 20% to 95% Humidity Wate Location : AMERICA North (USA-Canada-Mexico)

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ESSEMTEC PUMA2-PPD-C & Feeder Package - Barely used Usage: Approximately 55 production hours. This machine i Year(s) : 2023 Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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