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Used Semiconductor and PCB Manufacturing

9,373 results
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K&S 4524D Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digita Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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West Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 200 mm Set Size 200 mm Power Requirements 208 V 50.0 A 50/60 Hz Year(s) : 1994 Location : EUROPE (Western and Northern)

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Wafer Size Range Set Size 200 mm Power Requirements 208 V 80.0 A 50/60 Hz 3 Phase CE Marked Y Year(s) : 1999 Location : EUROPE (Western and Northern)

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MFG by EUNIL Co. 12.5" Magazine Width 110V Specifications ( See Details above for installed options ) Promati Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

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Vintage : FEB 2011 Details Model: TEX Includes (2) Tray Magazines 220V Specifications ( See Details above fo Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

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Vintage : MAR 2015 Details Left to Right Board Flow Edge Rail Only Specifications ( See Details above for in Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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Flying Probe Tester Year(s) : 2022 Location : ASIA (North East)

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cln: PCB cleaner Year(s) : 2017 Location : ASIA (North East)

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insp: Liquid-Particle Counter Location : ASIA (North East)

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• Resolution: 3 nm at 30 kV • Magnification: Up to 300,000× • Stage: 5-axis motorized • Sample Size: Supports Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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 Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil Year(s) : 2004 Location : EUROPE (Western and Northern)

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Still inside crates Year(s) : 2011 Location : EUROPE (Western and Northern)

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Process: Die Attach Condition: Working Year(s) : 2010 Location : EUROPE (Western and Northern)

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Reflow Oven Year(s) : 2003 Location : ASIA (North East)

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Reflow Oven Year(s) : 2005 Location : ASIA (North East)

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Reflow oven Year(s) : 2008 Location : ASIA (North East)

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Insertion Machine Model MultiSert Location : AMERICA North (USA-Canada-Mexico)

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Plasmatherm Versaline VLN ICP Etcher consisting of: - Manual Load Lock for Single or Multiple Wafers - Si Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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Die Bonder Model AD 838 Year(s) : 2013 Location : EUROPE (Western and Northern)

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ESEC 2100 FC HS Die Bonder De-installed. It should be complete, so they must go by the photos. Year(s) : 2017 Location : EUROPE (Western and Northern)

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 Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

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Chip mounter Year(s) : 2009 Location : ASIA (North East)

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Chip mounter Year(s) : 2010 Location : ASIA (North East)

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Stepper/6in. Location : ASIA (North East)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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