Menu

Used Semiconductor and PCB Manufacturing

9,133 results
1

This West-bond 7416A Manual Thermocompression Wedge Wire Bonder looks to be in good cosmetic condition, show Location : EUROPE (Western and Northern)

Price : On request

More details  
1

dry: ICP Etcher/380mm Location : ASIA (North East)

Price : On request

More details  
1

CVD Year(s) : 2008 Location : ASIA (North East)

Price : On request

More details  
1

cvd: LPCVD/DPLOY Location : ASIA (North East)

Price : On request

More details  
0

Wafer weighing system - Filmthickness Wafer Size Range Set Size 200 mm Accessories Wafer Scale (Mettle Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

More details  
1

Wafer weighing system - Filmthickness Wafer Size Range Minimum 200 mm Maximum 300 mm Other Informatio Year(s) : 2017 Location : EUROPE (Western and Northern)

Price : On request

More details  
1

Wafer weighing system - Filmthickness Wafer Size Range Set Size 200 mm Accessories Last Calibration of W Year(s) : 2015 Location : EUROPE (Western and Northern)

Price : On request

More details  
1

18" Max Board Width Model: EUS 01 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

More details  
1

Vintage : JUL 2013 Right To Left Board Flow Holds Up to 15" Wide Magazines Voltate: 110-230VAC 1ph Year(s) : 2013 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

More details  
1

CVD: MOCVD Year(s) : 2010 Location : ASIA (North East)

Price : On request

More details  
1

Vintage : SEP 1999 18" Max Board Wdith R-L Board Flow Omron CPM1 PLC Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

More details  
3

Grinder Heavy smoker DTU 150 Chiller DVC 010 Vacuum coolant unit Air supply source: Pressure: 0.5-0.8 MPa Location : ASIA (South East)

Price : On request

More details  
1

Flip Chip Bonder Model FCB3 Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

More details  
1

Can be set up for dotting or dispense epoxy Year(s) : 2019 Location : EUROPE (Western and Northern)

Price : On request

More details  
1

Die Bonder Model MCM-12 Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

More details  
1

coat: TRACK(1C3D) Location : ASIA (North East)

Price : On request

More details  

Price On request

More details
1

Stepper Year(s) : 1999, 2000 Location : ASIA (North East)

Price : On request

More details  
1

cvd: LPCVD/TEOS Location : ASIA (North East)

Price : On request

More details  
1

Configured for Top Side & Bottom Side Alignment (TSA/BSA) EISS 2.0 Enhanced Image Storage System EISS 2.0 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

More details  
1

Signatone S-1160A-5 Manual Analytical Wafer Probe Station. Wafer prober designed to support a broad range of Location : AMERICA North (USA-Canada-Mexico)

Price : On request

More details  
1

K&S 4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research Location : AMERICA North (USA-Canada-Mexico)

Price : On request

More details  
1

K&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to Location : AMERICA North (USA-Canada-Mexico)

Price : On request

More details  
1

Vintage : AUG 2013 Right To Left Board Flow Holds Up to 15" Wide Magazines 110-230V Year(s) : 2013 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

More details  
1

Vintage : NOV 2013 18" Max Board Width Omron CQM1 PLC Year(s) : 2013 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

More details  
1

Vintage : MAY 2013 Details Model: SG-II-E-3129 16" Max Board Width 44" Retracted - 71" Extended Keyence PLC Location : AMERICA North (USA-Canada-Mexico)

Price : On request

More details  

Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

Create an alert
});