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Used Semiconductor Equipment

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1

Wire Bonder Location : AMERICA North (USA-Canada-Mexico)

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Manufacturer ICOS Model WI-2200 + MH 200 AVI_WI-2000+HM200 spec This system is used as a set. Vintage : 2009 Year(s) : 2009 Location : EUROPE (Western and Northern)

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Inspection System Parts Tool Location : EUROPE (Western and Northern)

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Wafer Inspection System 200mm Good Condition Just out from 200mm fab Location : EUROPE (Western and Northern)

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DOM: 6/2016 Windows 7 Ultimate Year(s) : 2016 Location : AMERICA North (USA-Canada-Mexico)

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Plasma Etch Wafer Size Range Minimum 150 mm Maximum 150 mm Set Size 150 mm Other Information proc Year(s) : 1995 Location : EUROPE (Western and Northern)

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Accessories 3 monitors Condition Good Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Number of Cassette Platforms 24 Robot Ma Year(s) : 1999 Location : EUROPE (Western and Northern)

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Top Down Viewing Camera 120VAC 1500W Max Specifications ( See Details above for installed options ) YESTech’s Location : AMERICA North (USA-Canada-Mexico)

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1

INLINE AOI SYSTEM MODEL VT S500-02 Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

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Shadow Proof 3D Sensor 1D/2D Internal Reader Sigmalink Offline Review Software Vision 3D Program Inspection So Year(s) : 2020 Location : AMERICA North (USA-Canada-Mexico)

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Laser source Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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Contact Profilometer Version: 150 mm Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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System configured for AsP use Version: 100 mm • E475 Stainless Steel High Efficiency Growth Chamber. Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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200mm, s/n: AD40 Tool ID: ILDEP-02 Year(s) : 1996 Location : AMERICA North (USA-Canada-Mexico)

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200mm, s/n: 5267 Year(s) : 1990 Location : AMERICA North (USA-Canada-Mexico)

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FRONTIER - Etch for Junctions 300mm Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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Operational Status: Installed / Running Wafer Sizes: 4"/100mm Location : AMERICA North (USA-Canada-Mexico)

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ESEC Die Bonder Accessories Monitors Condition Good Year of Manufacture 2001 Year(s) : 2001 Location : EUROPE (Western and Northern)

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Plasma Etch Wafer Size Range Minimum 150 mm Maximum 150 mm Set Size 150 mm Other Information proc Year(s) : 1995 Location : EUROPE (Western and Northern)

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Model: M360CHD Indexer assy config Horizontal CPU: G Location : EUROPE (Western and Northern)

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Wafer Inspection Microscope Model MIS200 Location : EUROPE (Western and Northern)

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VERTICAL FEED, HEATED WORK HOLDERS AND HEATED TRANSDUCER OPTIONS Location : AMERICA North (USA-Canada-Mexico)

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Measurement: Film thickness/Fluorescent X-ray Model XDVN-W Location : ASIA (North East)

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The aluminum or gold wire size it uses is .7-3 mil The weight of this machine is 60 lbs and the size is 12″ W Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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