Used Semiconductor Equipment

Provides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including: Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Plasmatherm SLR-720/720 Dual Chamber RIE Reactive Ion Etch System. PC controller with graphical user interfac Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Plasmatherm SLR ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load loc Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFli Year(s) : 2017 Location : EUROPE (Western and Northern)

Price : On request

ASM AD898 die bonder, 2 sets ASM AD898 for sale Ex works China , both vintage 2006, Can Trial Run. Year(s) : 2002 Location : EUROPE (Western and Northern)

Price : On request

Nikon Eclipse L200D Nomarski 8" Wafer Inspection Microscope with Camera and Measuring Software. Includes a S Location : AMERICA North (USA-Canada-Mexico)

Price : On request

K&S 4524D Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digita Location : AMERICA North (USA-Canada-Mexico)

Price : On request

West Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size Range Set Size 200 mm Power Requirements 208 V 80.0 A 50/60 Hz 3 Phase CE Marked Y Year(s) : 1999 Location : EUROPE (Western and Northern)

Price : On request

insp: Liquid-Particle Counter Location : ASIA (North East)

Price : On request

• Resolution: 3 nm at 30 kV • Magnification: Up to 300,000× • Stage: 5-axis motorized • Sample Size: Supports Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

 Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Still inside crates Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

Process: Die Attach Condition: Working Year(s) : 2010 Location : EUROPE (Western and Northern)

Price : On request

Insertion Machine Model MultiSert Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Die Bonder Model AD 838 Year(s) : 2013 Location : EUROPE (Western and Northern)

Price : On request

ESEC 2100 FC HS Die Bonder De-installed. It should be complete, so they must go by the photos. Year(s) : 2017 Location : EUROPE (Western and Northern)

Price : On request

 Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

Stepper/6in. Location : ASIA (North East)

Price : On request

• Vacuum Units: 1 (second unit optional) • Press Capacity: 60 tons • Stroke Count: 62,133 • Features: Alarm & Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

Wet process machine Location : EUROPE (Western and Northern)

Price : On request

• Application: Final-stage polishing of hard materials (sapphire, SiC, GaN) • Down-force: High levels applied Location : AMERICA North (USA-Canada-Mexico)

Price : On request

• Wafer Size: 200 mm • Chuck Type: Temperature controlled (no chiller or controller included) • Microscope: Mi Location : AMERICA North (USA-Canada-Mexico)

Price : On request

GE Phoenix Micromex 180 KV PCBA X-ray System DOM: 3/2008 180KVA Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

• AOI microscope • Load Ports: 2 units of Brooks load port • Version: 300 mm • Sales Condition: As is where is Location : AMERICA North (USA-Canada-Mexico)

Price : On request