Used Semiconductor Equipment

Dry etching:RIE equipment Location : ASIA (North East)

Price : On request

Wafer Size Range Minimum 200 mm Maximum 200 mm Set Size 200 mm Number of Chambers 1 Process Capabi Year(s) : 2008 Location : EUROPE (Western and Northern)

Price : On request

Includes thin wafer handling kit 6" Can be converted to 8" 50/60 Hz 3 Phase 5 Wire 208V Location : EUROPE (Western and Northern)

Price : On request

Condition Excellent Year of Manufacture 2012 Year(s) : 2012 Location : EUROPE (Western and Northern)

Price : On request

It’s still installed but no longer under power. It was in Working Condition when decommissioned. Wafer : 8 Inc Year(s) : 2000 Location : EUROPE (Western and Northern)

Price : On request

Aligner/Double-sided Year(s) : 2001 Location : ASIA (North East)

Price : On request

Xray Diffractometers 300mm Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Plasma Processing Equipment and Tools Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

TPCC XE+ RP AB: Gate-ox (DPN+RTO);C:Singen Spacer Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

MANUAL LOAD PROBER AUTOMATICALLY PROBES UP TO A 6″ (150mm) WAFER INCLUDES LOW PROFILE TABLE AND STEREO ZOOM OP Location : AMERICA North (USA-Canada-Mexico)

Price : On request

dry: Etcher/6in. Year(s) : 2020 Location : ASIA (North East)

Price : On request

Aligner: Mask aligner/4in Year(s) : 2010 Location : ASIA (North East)

Price : On request

Film Thickness Measurement System Metrology Equipment Date of Manufacture: 2001-12-31 Currently Configured for Year(s) : 2001 Location : EUROPE (Western and Northern)

Price : On request

Brand: Koh Young Technology Power: 220V a.c Type: 3D SPI FEATURES: - Inspection speed at 0.24sec/FOV - 3D Sha Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

thermosonic ball bonder with manual Z lever and heated work holder. Location : AMERICA North (USA-Canada-Mexico)

Price : On request

manual wedge bonder with Z lever and U.S. generator. AUTO TUNE ULTRASONIC GENERATOR INCLUDES CALIBRATED STEREO Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Condition Good Exterior Dimensions Width 35.433 in (90.0 cm) Depth 47.244 in (120.0 cm) Height 66.92 Year(s) : 2000 Location : EUROPE (Western and Northern)

Price : On request

ESEC Die Bonder Accessories - Monitors Condition Good Year of Manufacture 2004 Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Thin Film Stress Measurement System, 150 mm and 200 mm wafer Location : AMERICA North (USA-Canada-Mexico)

Price : On request

909 ultrasonic wedge bonder is a simple yet very efficient semi-automatic bonder. It is specifically useful fo Location : AMERICA North (USA-Canada-Mexico)

Price : On request

FRONT SIDE ALIGNMENT HIGH RESOLUTION ALIGNMENT FOR UP TO 4″ WAFERS SUSS POWER SUPPLY Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

12.25×12.25 SQUARE BEAM (EXPOSURE HEAD IS MOTORIZED) 500 WATT LAMP, SPLIT FIELD VIDEO OPTICS WITH FLAT SCREEN Location : AMERICA North (USA-Canada-Mexico)

Price : On request

MidCurrent Implanter Condition Good Year of Manufacture 2002 Power Requirements 208 V CE Marked YES Year(s) : 2002 Location : EUROPE (Western and Northern)

Price : On request

Wafer Size Range Minimum 150 mm Maximum 300 mm Set Size 300 mm Number of Robots 1 Position 1 Tank M Year(s) : 2016 Location : EUROPE (Western and Northern)

Price : On request

TWS-M3111 Software Version TWS-M3111 Electric Schematic Number 81152323 Condition Very Good Power Requirement Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request