Used Semiconductor Equipment

Insp: Auto X-Ray Inspection System Location : ASIA (North East)

Price : On request

Features: Flexible range. Capable of 1 to 100W operation Greater stability Reproducible conditions Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Surface roughness measuring machine Year: Model: 2011 Measurement range/resolution: Z axis 800μm/0.01μm, 80 Year(s) : 2011 Location : ASIA (North East)

Price : On request

○Main specifications ・Product configuration: Atmospheric pressure plasma unit (Type FPE), plasma irradiation r Year(s) : 2015 Location : ASIA (North East)

Price : On request

Vintage: 12/2018 Benchtop 3D Automated Optical Inspection System Direct Loading Max PCB Size: 520mm Orca Chas Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Cylinder cabinet (NH3,NH3) Year(s) : 1993 Location : ASIA (North East)

Price : On request

Taping machine Year(s) : 1994 Location : ASIA (North East)

Price : On request

Full 3D Inspection (Actual 3D) Inspection Irrelevant to Color, Material, Surface Roughness Foreign Material & Year(s) : 2022 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Tape peeling machine Year(s) : 1998 Location : ASIA (North East)

Price : On request

Dry etching system (SiO2) Year(s) : 2011 Location : ASIA (North East)

Price : On request

Diffusion furnace (OX) Year(s) : 2000 Location : ASIA (North East)

Price : On request

Diffusion furnace (SOG bake) Year(s) : 1994 Location : ASIA (North East)

Price : On request

Fume hood Year(s) : 1989 Location : ASIA (North East)

Price : On request

Wafer Size 4 Year(s) : 2012 Location : ASIA (North East)

Price : On request

DICING SAW WITH SPLIT FIELD MICROSCOPE 6″ CAPABILITY Location : AMERICA North (USA-Canada-Mexico)

Price : On request

DICING SAW, 6X12″ CUTTING AREAIDEAL FOR CUTTING HARD MATERIALS Location : AMERICA North (USA-Canada-Mexico)

Price : On request

WAFER BONDER, BONDS RUBBER DISC TO WAFERS UP TO 6″ PRIOR TO DICING, SCRIBING Location : AMERICA North (USA-Canada-Mexico)

Price : On request

GOLD TIN REFLOW SYSTEM Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Maximum Board Size: 18” x 22” (458mm x 560mm) Minimum Component Size: 0.010” (0.25mm) 1.6 kW Focused Convectio Location : AMERICA North (USA-Canada-Mexico)

Price : On request

eS32 e-beam wafer inspection 200mm Condition Fair Serial Number(s) 2032 Year(s) : 2006 Location : EUROPE (Western and Northern)

Price : On request

Deep access vertical feed wedge bonder (bonds gold wire, gold ribbon or aluminum wire)20220610 152426 Includes Location : AMERICA North (USA-Canada-Mexico)

Price : On request

VERTICAL FEED WEDGE BONDER TRUE VERTICAL MOVEMENT DEEP ACCESSG20220214 143050 copy EXTENDED TRANSDUCER LARGE X Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size 8" Tool's Condition Refurbishing Step height: Nanometers to 1000µ;m Step height repeatability : 4 Year(s) : 2017 Location : ASIA (North East)

Price : On request

Wafer Size 8" Vintage 2012-3 Tool's Condition Refurbishing The KLA-Tencor P-16+ Profiler is a highly sensiti Year(s) : 2012 Location : ASIA (North East)

Price : On request

Model Dimension 7000 Wafer Size 8" Vintage 1996-3 Year(s) : 1996 Location : ASIA (North East)

Price : On request